Monday, 5 October: 9:00am‐4:00pm
Tuesday, 6 October: 9:00am‐4:00pm
Wednesday, 7 October: 9:00am‐4:00pm
Thursday, 8 October: 9:00am‐12:00pm
The exhibit area will be located in the Regency Ballroom. To ensure high visibility and foot traffic through the exhibit area, registration and all morning and afternoon breaks will be held there.
The exhibition will operate over four days. Rental fees for 2015 are $1500 per tabletop exhibit space with a special offer of 50% off for exhibitors paid by 31 July 2015. Sponsors at the $3000 level and above will be offered one free tabletop exhibit space.
Your exhibit fee includes:
▪ 1 – Technical Registration
▪ 1 – 8’ table, draped
▪ 2 – chairs
▪ 1 – wastebasket
▪ 1 – exhibitor identification sign
▪ Company Logo, contact information and weblink on IPC website
▪ Listing as Exhibitor on printed materials
The Ophir Photonics Group supplies laser users with world‐class laser performance measurement solutions around the world. Ophir laser power & energy measurement is the industry’s most accurate product line. Spiricon and Photon beam profilers provide the laser user with additional ways to more comprehensively determine the overall performance of their laser to ensure a quality, consistent laser performance over time.
Zurich Instruments AG
Zurich Instruments makes lock-in amplifiers, phase-locked loops, and impedance spectroscops that have revolutionized instrumentation in the high-frequency (HF) and ultra-high-frequency (UHF) ranges by combining frequency-domain tools and time-domain tools within each product. This reduces the complexity of laboratory setups, removes sources of problems and provides new measurement approaches that support the progress of research.
Hamamatsu Corporation is the North American subsidiary of Hamamatsu Photonics K.K. (Japan), a leading manufacturer of devices for the generation and measurement of infrared, visible, UV light and x-rays. These devices include silicon photomultipliers (MPPC), mini-spectrometers, photomultiplier tubes, photodiodes, image sensors, cameras, and light sources.
Sub-micron accuracy bonders for photonics packaging and assembly -- laser bars, VCSELs, photo diodes, MEMs, sensors, LEDs, flip chip, copper pillar, etc. High process flexibility within one platform, accommodating thermo-compression, thermo-sonic, eurectic, epoxy, ACF & Indium bonding. We collaborate with customers to udnerstand their complex applications, and deliver a purpose-built solution.
Want to exhibit at the conference?
Please contact us for more information or to discuss other opportunities:
Ingrid L. Donnelly, CMP
Senior Conference Planner
Phone +1 732 562 5597
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